A review of the electric measurements and their failure criteria for solder joint degradation
  • Metaadatok
Tartalom: https://real.mtak.hu/204598/
Archívum: REAL
Gyűjtemény: Status = In Press
Type = Article
Subject = Q Science / természettudomány: QC Physics / fizika: QC173.4 Material science / anyagtudomány
Cím:
A review of the electric measurements and their failure criteria for solder joint degradation
Létrehozó:
Varga, Dorottya
Szabó, Péter János
Szlancsik, Attila
Dátum:
2025
Téma:
QC173.4 Material science / anyagtudomány
Tartalmi leírás:
The assessment of solder joint quality and reliability in electronic devices has an important role in many industries and guarantees challenges for reliability engineers. This article explores various methods for the electrical measurement of solder joints, focusing on resistance measurement, impedance measurement, and thermal resistance measurement. Based on the presented articles, impedance measurement emerges as the most effective method, although its complexity can limit its profitability. Resistance measurement, while approaching the accuracy of impedance measurement, is more widely used due to its simplicity. Thermal resistance measurement, although complicated, provides less precise results compared to the other methods. Various standards define failure based on similar criteria, with IPC-9701B offering the latest and best-defined criteria for data logger measurements. It is suggested that future literature adopt this evaluation method to enhance the comparability of different measurement results for solder joint failure. The relationship between crack length and electrical properties is crucial for detecting and predicting potential failures in solder joints. Establishing a clear connection between crack length and electrical properties can lead to more rational failure criteria, reducing the likelihood of overdesigning solder joints.
Nyelv:
angol
Típus:
Article
PeerReviewed
info:eu-repo/semantics/article
Formátum:
text
Azonosító:
Varga, Dorottya and Szabó, Péter János and Szlancsik, Attila (2025) A review of the electric measurements and their failure criteria for solder joint degradation. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 185. No. 108863. ISSN 1369-8001 (In Press)
Kapcsolat:
MTMT:35194009 10.1016/j.mssp.2024.108863
Létrehozó:
cc_by_nc